首頁外文書人文科普 〉Through Silicon Vias: Materials, Models, Design, and Performance
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Through Silicon Vias: Materials, Models, Design, and Performance

Through Silicon Vias: Materials, Models, Design, and Performance


作者  /  Brajesh Kumar Kaushik / Vobulapuram Ramesh Kumar/ Manoj Kumar Majumder/ Arsalan Alam

出版社 / CRC Press

出版日期 / 2016/08/05

商品語言 / 英文

裝訂 / 精裝

定價 / NT$9,000

售價 / NT$ 9,000 ※ 特價商品,不再折扣

※ 無庫存


Through Silicon Vias: Materials, Models, Design, and Performance 其它優惠/消息


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內容簡介

Fundamentals of Semiconductor Devicesprovides a realistic and practical treatment of modern semiconductor devices. A solid understanding of the physical processes responsible for the electronic properties of semiconductor materials and devices is emphasized. With this emphasis, the reader will appreciate the underlying physics behind the equations derived and their range of applicability. The author’s clear writing style, comprehensive coverage of the core material, and attention to current topics are key strengths of this book.Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.







詳細資料

誠品26碼 /2681442921009
ISBN 13 /9781498745529
ISBN 10 /1498745520
EAN /9781498745529

頁數232
尺寸23.5X15.9X1.9CM
裝訂精裝
級別
語言英文




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